With the continuous development of the Internet, PCB is the main conductor of electronic components and more important electronic components. Now PCB is widely used in electronic products. Every time we finish PCB design, it is very important to control the production cost. So how to reduce the production cost of PCB?

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1) The influence of PCB size design on cost

The original size of copper plate is too large, so it is not convenient to process, sometimes it cannot even be put into the PCB processing equipment for processing, so it needs to be cut into several pieces of copper plate of processing size first. As for the specific size of processing size, it needs to be determined according to the processing equipment, the size of each PCB and some process parameters. These process parameters include not only the length and width required by the printed circuit diagram itself, but also the width consumed by fixing the screw hole of the printed circuit board on the electronic product frame, the process allowance of the outline processing, the fixture retention during the chemical plating, electroplating and corrosion, the retention of the locating pin when the printed circuit board is multi-layer, the retention of the alignment mark between layers, and the production of the printed circuit board Manufacturer's mark retention, PCB edge width, etc. some of the recommended process parameters can be obtained from the copperplate manufacturer or dealer. During the production and processing of printed circuit, it can be determined according to the above data how many pieces of copper clad plates of processing size are cut from a large original size copper clad plate, whether they are cut vertically or horizontally, whether they can be cut in sets, etc.

2) The influence of the number of layers of PCB on the cost

With the increase of the number of layers, the production cost of printed circuit board will increase dramatically, so it is possible to cause a large difference in cost due to the difference of one thought. If you encounter difficulties in designing a 6-layer PCB, you should never give up. Perhaps a large amount of economic benefits are in your efforts to stick to it. However, it is not easy to avoid it, because in most cases, the designer may not hesitate to design an 8-layer PCB.

3) CEM-3 materials

In addition to the widely used double-sided epoxy resin glass cloth copper plate, there is also a low-cost CEM-3 material. Its structure is to change the thick epoxy resin glass cloth used as the base material in the original double-sided epoxy resin glass cloth copper plate into two very thin sheets. At this time, due to the insufficient strength, the two thin sheets are made of epoxy resin glass cloth The epoxy glass non-woven fabric is sandwiched between the sheets of epoxy glass cloth, thereby reducing the cost. CEM-3 material has a soft texture, which can be used as the core material of multilayer rigid printed circuit board in addition to being used alone.

4) The effect of the ratio of the line width of the conductor pattern to the gap width on the cost

Whether the width of the conductive pattern in the printed wiring board is represented by L, and the width of the gap between the conductor patterns is represented by S, and then LIS represents the ratio of the width of the conductive tape to the width of the gap. The production yield of printed circuit boards will decrease sharply and the cost will rise. This phenomenon is more obvious when the circuit density is relatively high. Therefore, the value of LIS must not be arbitrarily replaced.

5) The effect of the parasitic through-hole on the cost

In the case of using a drill to punch a printed circuit board, when some other value is behind, the drilling depth of the drill will change drastically. At the same time, a hole is drilled at the same time. When drilling a hole with a small diameter, the drill bit needs to exit the heat dissipation multiple times, which will reduce production efficiency and increase costs.

6) Fill the through hole with silver paste

For the through-holes of the double-sided printed circuit board, the copper plating method is not used to realize the communication of the two sides of the circuit, and the method of filling the via hole with silver is used alternately, which can also reduce the cost of the double-sided printed circuit board.

The semiconductor production process is composed of wafer manufacturing, wafer testing, chip packaging and post packaging testing. A plurality of chips are manufactured on a single chip, and each chip is cut and packaged. Many of the same tooling, material and panel size constraints also exist in PCB manufacturing.