An integrated circuit is a miniature electronic device or component. Adopt a certain process to interconnect transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, make it on a small or several small semiconductor wafers or dielectric substrates, and then package them in a tube case , To become a micro-structure with the required circuit functions; where all the components have been integrated into a whole, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented in the circuit by the letter "IC". Most applications in the semiconductor industry today are silicon-based integrated circuits.

It is through a semiconductor manufacturing process such as oxidation, photolithography, diffusion, epitaxy, and aluminum vaporization. It integrates semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and the connecting wires between them in a small piece of silicon. On-chip, then soldered electronics packaged in a tube and shell. Its package shell has a variety of forms such as round shell, flat or dual in-line.

1. Characteristics

Integrated circuits, or microcircuits, microchips, and chips, are a way to miniaturize circuits (mainly including semiconductor devices and passive components) in electronics, and usually make On the surface of a semiconductor wafer.

The aforementioned integrated circuit in which a circuit is manufactured on the surface of a semiconductor chip is also referred to as a thin-film integrated circuit. Another type of thick-film hybrid integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board.

2. Classification

2.1 Functional structure
Integrated circuits, also known as ICs, can be divided into three categories: analog integrated circuits, digital integrated circuits, and digital / analog hybrid integrated circuits according to their functions and structures.

2. 2 Production process
Integrated circuits can be divided into semiconductor integrated circuits and film integrated circuits according to the manufacturing process.
Film integrated circuits are classified into thick film integrated circuits and thin film integrated circuits.

3. IC Types

1) BGA (ball grid array)

Ball contact array, one of the surface mount packages.

2) BQFP (quad flat package with bumper)

Flat four-lead package with cushion.

3) C－ (ceramic)

Symbol for ceramic package. For example, CDIP stands for ceramic DIP. It is a mark often used in practice.

4) Cerdip

Glass sealed ceramic dual in-line package for ECL RAM, DSP (Digital Signal Processor) and other circuits.

5) Cerquad

One of the surface-mount packages is a sealed ceramic QFP, which is used to package logic LSI circuits such as DSPs.

6) COB (chip on board)

On-chip chip packaging is one of the bare chip placement technologies.

7) DFP (dual flat package)

Flat package on both sides. It is another name for SOP (see SOP).

8) DIC (dual in-line ceramic package)

Another name for ceramic DIP (including glass seal) (see DIP).

9) DIL (dual in-line)

Another name for DIP (see DIP). European semiconductor manufacturers often use this name.

10) DIP (dual in-line package)

Dual in-line package. One of the plug-in packages, the pins are drawn from both sides of the package, and the package materials are plastic and ceramic.

11) DSO (dual small out-lint)

Small form factor package on both sides. Another name for SOP (see SOP). Some semiconductor manufacturers use this name.

12) DICP (dual tape carrier package)

Double-sided pin carrier package. One of TCP (Tape Loaded Encapsulation).

13) DIP (dual tape carrier package)

Ibid. The Japanese Electronic Machinery Industry Association named DTCP (see DTCP).

14) FP (flat package)

Flat package. One of the surface mount packages. Another name for QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.

15) flip-chip

Flip the chip. One of the bare chip packaging technologies,

16) FQFP (fine pitch quad flat package)

The center of the small pin is QFP. Usually refers to QFP (see QFP) with a pin-to-center distance of less than 0.65mm. Some conductor manufacturers use this name.

17) CPAC (globe top pad array carrier)

Another name for BGA by Motorola, USA (see BGA).

18) CQFP (quad fiat package with guard ring)

Four-lead flat package with guard ring.

19) H- (with heat sink)

Indicates a mark with a heat sink. For example, HSOP means SOP with heat sink.

20) pin grid array (surface mount type)

Surface mount PGA. Usually PGA is a plug-in package with a lead length of about 3.4mm.

21) JLCC (J-leaded chip carrier)

J-shaped chip carrier. Refers to other names for windowed CLCC and windowed ceramic QFJ (see CLCC and QFJ). The name adopted by some semiconductor manufacturers.

22) LCC (Leadless chip carrier)

Leadless chip carrier. Refers to a surface mount package where the four sides of the ceramic substrate have only electrode contact and no leads. It is a package for high-speed and high-frequency ICs, also known as ceramic QFN or QFN-C (see QFN).

23) LGA (land grid array)

Contact display package. That is, a package with an array of state electrode contacts is made on the bottom surface. Just plug in the socket during assembly.

24) LOC (lead on chip)

On-chip lead package. One of the LSI packaging technologies,

25) LQFP (low profile quad flat package)

Thin QFP. Refers to the QFP with a package body thickness of 1.4mm, which is the name used by the Japan Electromechanical Industry Association based on the new QFP outline specifications.

26) L-QUAD

Ceramic QFP one. Aluminum nitride for package substrates has a base thermal conductivity that is 7-8 times higher than alumina, and has good heat dissipation.

27) MCM (multi-chip module)

Multi-chip components. A package in which a plurality of semiconductor bare chips are assembled on a wiring substrate.

28) MFP (mini flat package)

Small flat package. Alternative name for plastic SOP or SSOP (see SOP and SSOP). The name adopted by some semiconductor manufacturers.

29) MQFP (metric quad flat package)

A classification of QFP according to JEDEC (United States Electronic Equipment Council) standards.

30) MQUAD (metal quad)

A QFP package developed by Olin Corporation. The substrate and cover are made of aluminum and sealed with an adhesive.

31) MSP (mini square package)

Another name for QFI (see QFI) is often called MSP in the early stages of development. QFI is a name prescribed by the Japan Electromechanical Industry Association.

32) P－ (plastic)

A mark indicating a plastic package. For example, PDIP means plastic DIP.

33) PAC (pad array carrier)

Bump display carrier, another name for BGA (see BGA).

34) OPMAC (over molded pad array carrier)

Moulded resin seal bump display carrier. The name Motorola uses for molded resin-sealed BGAs (see BGA).

35) PFPF (plastic flat package)

Plastic flat package. Another name for plastic QFP (see QFP). The name adopted by some LSI manufacturers.

36) PGA (pin grid array)

Display pin package. One of the plug-in packages has vertical pins on the bottom surface arranged in a display. The packaging substrate is basically a multilayer ceramic substrate.

37) Piggy back

Ballast package. Refers to a ceramic package with a socket. The shape is similar to DIP, QFP, QFN.

38) PLCC (plastic leaded chip carrier)

Leaded plastic chip carrier. One of the surface mount packages.

39 ) P－LCC (plastic teadless chip carrier) (plastic leaded chip currier)

Sometimes it is another name for plastic QFJ, sometimes it is another name for QFN (plastic LCC) (see QFJ and QFN).

40) QFH (quad flat high package)

Four-sided thick-body flat package. A type of plastic QFP. In order to prevent the package body from breaking, the QFP body is made thicker (see QFP). The name adopted by some semiconductor manufacturers.

41) QFI (quad flat I-leaded packgac)

Four-sided I-lead flat package. One of the surface mount packages.

42) QFJ (quad flat J-leaded package)

Four-sided J-lead flat package. One of the surface mount packages.

43) QFN (quad flat non-leaded package)

Four-sided leadless flat package. One of the surface mount packages. In the late 1990s, it was often called LCC.

44) QFP (quad flat package)

Four-lead flat package. One of the surface-mount packages. The pins are drawn from four sides into a seagull wing (L) shape.

45) QFP (FP) (QFP fine pitch)

Small center distance from QFP. The name specified by the Japan Electromechanical Industry Association standards.

46) QIC (quad in-line ceramic package)

Another name for ceramic QFP. The name adopted by some semiconductor manufacturers (see QFP, Cerquad).

47) QIP (quad in-line plastic package)

Another name for plastic QFP. The name adopted by some semiconductor manufacturers (see QFP).

48) QTCP (quad tape carrier package)

Four-sided pin carrier package. One of the TCP packages. Pins are formed on the insulation tape and lead out from the four sides of the package.

49) QTP (quad tape carrier package)

Four-sided pin carrier package. The name used by the Japan Electromechanical Industry Association for the outline specifications of QTCP in April 1993 (see TCP).

50) QUIL (quad in-line)

Another name for QUIP (see QUIP).

51) QUIP (quad in-line package)

Four-row lead-in package.

52) SDIP (shrink dual in-line package)

Shrinking DIP. One of the plug-in packages, the shape is the same as DIP, and the materials are ceramic and plastic.

53) SH-DIP (shrink dual in-line package)

Same as SDIP. The name adopted by some semiconductor manufacturers.

54) SIL (single in-line)

Another name for SIP (see SIP). European semiconductor manufacturers mostly use the name SIL.

55) SIMM (single in-line memory module)

Single-rank memory module.

56) SIP (single in-line package)

Single in-line package.
57) SK-DIP (skinny dual in-line package)

A type of DIP. Refers to a narrow body DIP with a width of 7.62mm and a lead center distance of 2.54mm. Commonly referred to as DIP (see DIP).

58) SL-DIP (slim dual in-line package)

A type of DIP. Refers to a narrow body DIP with a width of 10.16mm and a lead center distance of 2.54mm. Commonly referred to as DIP.

59) SMD (surface mount devices)

Surface mount devices. Occasionally, some semiconductor manufacturers classify SOP as SMD (see SOP). Another name for SOP. Many semiconductor manufacturers in the world use this nickname. (See SOP).

60) SOI (small out-line I-leaded package)

Small I-lead package. One of the surface mount packages.

61) SOIC (small out-line integrated circuit)

Another name for SOP (see SOP). Many semiconductor manufacturers abroad use this name.

62) SOJ (Small Out-Line J-Leaded Package)

Small J-lead package. One of the surface mount packages.

63) SQL (Small Out-Line L-leaded package)

The name used for the SOP in accordance with JEDEC (United States Electronic Equipment Engineering Council) standards (see SOP).

64) SONF (Small Out-Line Non-Fin)

No heat sink SOP. Same as usual SOP.

65) SOP (small Out-Line package)

Small outline package. One of the surface mount packages, the pins lead out from both sides of the package into a seagull wing shape (L-shaped).

66) SOW (Small Outline Package (Wide-Jype))

Wide body SOP. The name adopted by some semiconductor manufacturers.

67) PCLP (printed circuit board leadless package)

Printed circuit board leadless package. The name adopted by Fujitsu of Japan for plastic QFN (plastic LCC) (see QFN).