Gold Plated PCB is electroplating a layer of gold on the surface of circuit board.

Gold plating is a kind of decoration technology and one of the common words used. It refers to plating a thin layer of gold on the surface of utensils. The method is to deposit a thin layer of gold and mercury, and then add sensible heat to make the mercury volatilize. To attach gold to the surface of a metal or other object by electrolysis or other chemical means to form a thin layer of gold.

Generally, the process of installing passive components and active integrated circuits on PCB can be divided into electrolytic gold plating process and electroless gold plating process according to the wire bonding mode. At this point, electroless gold plating process has the disadvantage of separation between copper and nickel contact surface during lead joining process of PCB. Therefore, electrolytic gold plating process is more commonly used than electroless gold plating process. Different from other processes of PCB surface treatment, electrolytic gold plating process can be divided into electrolytic soft gold plating process and electrolytic hard gold plating process. The electrolytic gold plating process has advantages in the case of thick electrolytic gold plating layer, with high productivity and high peel strength reliability.