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Aluminum PCB
Posted: May 14, 2022 By: Bonnie

Aluminum PCB

Aluminum PCB is a kind of metal-based copper clad laminate with good heat dissipation function. Generally, single panel consists of three layers, namely circuit layer (copper foil), insulation layer and metal base. Used for high-end use is also designed for double panels, the structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer. Very few applications are multi-layer boards, which can be made by bonding ordinary multi-layer boards with insulating layer and aluminium base.
Aluminum PCB

LED PCB is Aluminum PCB, which is also the meaning of printed circuit board, but the material of PCB is aluminum alloy. In the past, the material of PCB is glass fiber, but because the heat of LED is bigger, the PCB used for LED lamps is generally aluminum Substrate, which can conduct heat quickly. The PCB used for other equipment or electrical appliances is glass fiber board.


Structure of aluminum PCB
PCB aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate


1) Circuit layer: equivalent to common PCB copper clad laminate, circuit copper foil thickness from 1oz to 10oz.


2) Insulating layer: insulating layer is a layer of low thermal resistance thermal insulation material. Thickness: 0.003 "to 0.006" inch is the core technology of aluminum based copper clad laminate, which has obtained UL certification.


3) Base: is a metal substrate, generally aluminum or optional copper. Aluminum based copper clad laminates and traditional epoxy glass cloth laminates
PCB aluminum substrate is composed of circuit layer, thermal insulation layer and metal base layer; circuit layer (i.e. copper foil) is usually etched to form printed circuit, so that the components of components are connected with each other. Generally, the circuit layer requires a large current carrying capacity, so thick copper foil should be used, with a thickness of 35 μ m ~ 280 μ M. Thermal insulation layer is the core technology of PCB aluminum substrate. It is generally composed of special polymer filled with special ceramics. It has small thermal resistance, excellent viscoelastic performance, thermal aging resistance, and can withstand mechanical and thermal stress. This technology is used in the thermal insulation layer of High Performance PCB aluminum substrate, such as IMS-H01, IMS-H02 and LED-0601, which makes them have excellent thermal conductivity and high strength electrical insulation performance.


Metal base is the support component of aluminum substrate, which requires high thermal conductivity. Generally, aluminum plate can be used, and copper plate can be used (copper plate can provide better thermal conductivity), which is suitable for drilling, punching, cutting and other conventional machining. Compared with other materials, PCB material has incomparable advantages. Suitable for SMT technology of power module surface mounting. Without radiator, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.


Working principle
The surface of the power device is mounted on the circuit layer. The heat generated by the operation of the device is quickly transmitted to the metal base through the insulation layer, and then the heat is transferred from the metal base to achieve the heat dissipation of the device.

Compared with the traditional FR-4 the aluminium PCB can reduce the thermal resistance to the minimum, which makes the aluminium substrate have excellent thermal conductivity. Compared with the thick-film ceramic circuit its mechanical properties are better.

In addition, aluminum PCB have the following unique advantages:

It meets the requirements of RoHs and it is more suitable for SMT process.

In the design of the circuit, thermal diffusion is treated effectively to reduce the operating temperature of the module, prolong the service life, and improve the power density and reliability.

Reduce the assembly of radiator and other hardware (including thermal interface materials), reduce product volume, reduce hardware and assembly costs, optimize the combination of power circuit and control circuit. Substitute the fragile ceramic substrates for better mechanical durability.
Do you have any questions about the above-mentioned? Contact us now, we will reply to you soon.
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