The full name of BGA is "Ball grid array” which is used by most intel mobile CPUs. In the 1990s, with the progress of integrated technology, the improvement of equipment and the use of deep sub-micron technology, LSI, VLSI and ULSI have appeared one after another. The integration of silicon single chip is continuously improved, and the requirements for integrated circuit packaging are more stringent. The number of I / O pins increases rapidly, and the power consumption also increases. In order to meet the needs of development, a new type of ball grid array package is added.

Compared with TSOP, BGA has smaller volume, better heat dissipation and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch. Under the same capacity, the volume of memory products using BGA packaging technology is only one-third of that of TSOP packaging. In addition, compared with the traditional TSOP packaging method, BGA packaging method has a faster and more effective heat dissipation way.

The I / O terminals of BGA package are distributed under the package in the form of circular or columnar solder joints. The advantage of BGA technology is that although the number of I / O pins is increased, the spacing between the pins does not decrease, so the assembly yield is improved. Although the power consumption is increased, the BGA can be welded by the controllable collapse chip method, which can improve its thermal performance. The thickness and weight of BGA are relatively small The former packaging technology has been reduced; parasitic parameters (output voltage disturbance caused by large current change) are reduced, signal transmission delay is small, and the use frequency is greatly improved; the assembly can be coplanar welding, with high reliability.

BGA has become the best choice for high density, high performance, multi-function and high I / O pin package of VLSI chips such as CPU and North-South bridge.

Its characteristics are as follows:

1) Although the number of I / O pins increases, the distance between pins is much larger than that of QFP, which improves the assembly yield;

2) Although its power consumption is increased, BGA can be welded by controlled collapse chip method, referred to as C4 welding;

3) The thickness and weight of QFP are reduced by more than 1 / 2 and 3 / 4, respectively;

4) The parasitic parameters are reduced, the signal transmission delay is small, and the use frequency is greatly increased;

5) Assembly can be coplanar welding, high reliability;

6) BGA packaging is still the same as QFP and PGA, occupying too much substrate area;

Intel company uses ceramic pin grid array to package CPGA and ceramic ball grid array to package CPGA and CBGA to package CPU chips with high integration (more than 3 million transistors in a single chip) and high power consumption CPU chips, such as Pentium, Pentium pro and Pentium II. Micro exhaust fan is installed on the shell to dissipate heat, so as to achieve stable and reliable operation of the circuit.

With the development of integrated circuit technology, the requirements of integrated circuit packaging are more stringent. This is because the packaging technology is related to the functionality of the product. When the frequency of IC exceeds 100 MHz, the so-called "crosstalk" phenomenon may occur in the traditional packaging method. Moreover, when the number of pins of IC is greater than 208 pin, the traditional packaging method has its difficulty. Therefore, in addition to QFP packaging, most of today's high pin chips (such as graphics chips and chipsets) have switched to BGA (ball grid array package) packaging technology. BGA has become the best choice for CPU, south / north Bridge chip and other high-density, high-performance, multi pin package.